E Series Global 3G Module
The E Series is Particle’s newest product family of industrialized cellular IoT modules. E Series Product Features Particle’s E Series is a new family of production-grade 2G, 3G, and LTE-enabled hardware that vastly reduces the cost and complexity of deploying cellular-connected IoT solutions at scale. All E Series modules include the following features: - Embedded SIM card, which resists vibration, corrosion, and mechanical failure - Surface-mountable design, for PCB assembly in mass-production - Industrial temperature range from -20 to 85C for deployment in hostile environments - Future-compatible pinout with support for 2G and 3G today and a seamless transition to LTE M1 and NB1 in 2018 - Fully certified design virtually eliminating the cost and complexity of RF and carrier compliance - Built-in compatibility with Particle's development tools, messaging platform, and device management console The E310 module supports worldwide 2G and 3G connectivity and can be configured into a 2G only mode. All Particle Hardware is designed from the ground up to work with the Device Cloud. The Device Cloud is a powerful set of tools and infrastructure to build, connect, and manage your IoT fleet. Access to the Device Cloud includes: 3MB of cellular data per device/mo (additional data $0.40/MB for most countries) First 3 months of Device Cloud FREE ($2.99 per device/mo after) Device Cloud Features: - Device Management - Over the Air Firmware Updates - Fully Managed Connectivity - Developer Tools - Integrations Specs: STM32F205 ARM Cortex M3 microcontroller 1MB Flash, 128K RAM Cellular modem: u-blox SARA U-series (3G Global with 2G fallback) 36 pins total: 28 GPIOs (D0-D13, A0-A13), plus TX/RX, 2 GNDs, VIN, VBAT, WKP, 3V3, RST Board dimensions: 36mm x 43mm Continent compatibility is simplified and exceptions exist. Please be sure to check the full list of compatible countries for the location in which your product will be deployed.